---
title: "Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging"
date: 2026-07-14
source: http://www.bing.com/news/apiclick.aspx?ref=FexRss&aid=&tid=6a59567ae1d94db58dd40c71273dfd4e&url=https%3a%2f%2fwww.forbes.com%2fsites%2fmarcochiappetta%2f2026%2f07%2f15%2fcadence-expands-ai-agents-with-aurastack-for-pcb-and-advanced-chip-packaging%2f&c=3424101593548742671&mkt=en-us
description: "Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent."
---

# Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent.

*Published: 2026-07-14*