---
title: "Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging"
date: 2026-07-15
source: http://www.bing.com/news/apiclick.aspx?ref=FexRss&aid=&tid=6a58a899b68545538fcb8bc4f821d142&url=https%3a%2f%2fsiliconangle.com%2f2026%2f07%2f15%2fcadence-extends-ai-agents-beyond-chips-aurastack-circuit-boards-packaging%2f&c=6211851951991627429&mkt=en-us
description: "Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial intelligence agent that assists with packaging and system design, the step after ..."
---

# Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial intelligence agent that assists with packaging and system design, the step after ...

*Published: 2026-07-15*