---
title: "Cadence Automates PCB Design With AI Super Agents"
date: 2026-07-14
source: http://www.bing.com/news/apiclick.aspx?ref=FexRss&aid=&tid=6a588fe255b74ceeb99b7a24bb49799b&url=https%3a%2f%2fwww.forbes.com%2fsites%2fkarlfreund%2f2026%2f07%2f15%2fcadence-automates-pcb-design-with-ai-super-agents%2f&c=12879251841219354286&mkt=en-us
description: "Cadence is rapidly deploying \"Super Agents\" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and advanced multi-chip packaging design."
---

# Cadence Automates PCB Design With AI Super Agents

Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and advanced multi-chip packaging design.

*Published: 2026-07-14*