---
title: "Open AI agent phone to be powered by 2nm Dimensity 9600"
date: 2026-05-04
source: http://www.bing.com/news/apiclick.aspx?ref=FexRss&aid=&tid=69f999bebc7548f8a284548bf721b970&url=https%3a%2f%2fwww.gizmochina.com%2f2026%2f05%2f05%2fopen-ai-phone-chipset-launch-timeframe%2f&c=6260583158418633559&mkt=en-us
description: "OpenAI may develop AI agent smartphone with MediaTek chip, new architecture, and agent-first interface replacing apps. Mass production could begin by 2027."
---

# Open AI agent phone to be powered by 2nm Dimensity 9600

OpenAI may develop AI agent smartphone with MediaTek chip, new architecture, and agent-first interface replacing apps. Mass production could begin by 2027.

*Published: 2026-05-04*
